Semiconductor mounting wax stripper


Cooling wafer platform 36 also accelerates solidifying of any residual wax on semiconductor wafer 12 thereby reducing the tendency for wafer 12 to stick to the surface of wafer platform The gallium arsenide wafer and the submount are pressed together while the wax is hot. Briefly stated, this invention comprises an assembly comprising a semiconductor wafer bonded to a submount using a wax dissolved in solvent as a bonding material. Comes in a 1 oz. The method for attaching a semiconductor wafer to a submount of claim 9 wherein the forming step includes placing the semiconductor wafer on the submount such that on the semiconductor wafer or the submount having wax thereon bonds the semiconductor wafer to the submount. Blue plastic, non-hardening putty easily positions difficult materials at the angle you want to examine them or holds items in place during specimen preparation. Comes in a 3g tube.
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Semiconductor Materials

These wash away adhesives are used as a temporary bond for holding delicate crystals, metallurgical specimens, glass components, and ceramic substrates for dicing, slicing, drilling and polishing. After application it can be dissolved rapidly in trichloroethylene or toluene. Material Science and Metrology. While it is resistant to many acids, it can be easily removed with hydrocarbon or chlorinated solvents. Sorry you have already received your one time free sample. A clear, fast curing cyanoacrylate adhesive developed as an alternative for bonding samples and non-porous materials to similar materials or glass.
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Crystalbond™ Wafer-Mount Embedding Media for the Materials Sciences

Dissolves in acetone or MEK. This trust is built upon our company's long-standing quality policy, which makes it one of our priorities to identify the needs and expectations of users in order to fulfil them in a quick, effective and environmentally friendly manner. In addition to its proven record of usage and unparalleled feats of high vacuum, high temperature and low thermal resistance, AIT temporary bonding adhesives are the most comprehensive material solutions innovated and manufactured in the United States. The substrate is positioned on the film and pressed down firmly so that it adheres to the plastic film. Viscosity at flow point is 6,cps.
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Semiconductor mounting wax stripper
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Mounting Adhesives

Semiconductor mounting wax stripper



Description: No heating is required; just remove the paper backing to expose the adhesive layer, position the wafer substrate on the film and press down with firm pressure to insure adhesion. In common with other organic materials, oxidation and sublimation effects at elevated temperatures limit life. It will keep the adhesive stable for years. The adhesive sheet should be placed on the dull or back side of the wafer, not the top or shiny side. Sold in bottles of 0.

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